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Omron inlays are designed to provide high quality, durability, and repeatability.
Omron's patented ultra-sonic bonding technology called JOMFUL is the process used to join the IC chip to the antenna, producing the strongest bond as compared to any other conventional method.

	Gen1	C1 Gen2

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Model Number	Gen1 Wave V740-D12P01	Gen2 Wave V750-D22M01-IM	Gen2 Loop V750-D22M02-IM	Gen2 Ninja V750-D22M03-IM-US
Antenna Size	3.70 x 0.63 inch (94.0mm x 16.0mm)	3.70 x 0.63 inch (94.0mm x 16.0 mm)	2.76 x 2.68 inch (70.0mm x 68.0mm)	1.10 x 1.10 inch (28.0mm x 28.0mm)
Chip	EPCglobal Class1/ST Microelectronics	EPCglobal Class1 Genaration2 (Gen2)/ Impinj Monza
Memory	128-Bit EEPROM	MVN (EPC Area 96bit)
Operation Frequency	915MHZ	860-960MHz		902-928MHz 952-955MHz
Antenna Material	Cupper	Aluminum
Operating Temperature	-20 to 55°C(-4 to 131°F) (with no icing, no condensation)
Storage Temperature	-20 to 55°C(-4 to 131°F) (with no icing, no condensation)
Application Example	General Purpose/Case Level Tagging	General Purpose/Case level Tagging	For RF Unfriendly Material, Metallic/High Moisture Content, Pallet	Item tagging, Plastic Bottle